Companies sign memorandum of understanding to broaden collaboration on
next-generation AI infrastructure, spanning leading-edge memory, foundry technologies and advanced packaging
Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure.
The MOU was announced during the AI Summit, held at The Midway in San Francisco. Attendees included Jinman Han, President and Head of Samsung Electronics’ Foundry Business, Hock Tan, President and CEO of Broadcom, senior executives from both companies and representatives of the Korean government.
The companies expect the collaboration to be estimated at more than $200 billion across memory and foundry over the next five years through 2030.
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including High Bandwidth Memory (HBM), supporting Broadcom’s next-generation AI accelerators.
In foundry, the companies’ collaboration focuses on Samsung’s 2-nanometer (nm) and below process technologies for Broadcom’s products, including Wireless Broadband Communications (WBC) solutions. The collaboration is expected to extend to advanced packaging technologies built on Samsung’s 2nm process, including 2.3D and 2.5D integration, to enable higher-performance and more power-efficient AI and networking silicon.
“AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging,” said Young Hyun Jun, Vice Chairman & CEO of the Device Solutions (DS) Division at Samsung Electronics. “By expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future.”
“As AI infrastructure continues to scale, close collaboration across the semiconductor ecosystem becomes increasingly important,” said Charlie Kawwas, President, Semiconductor Solutions Group of Broadcom. “By combining Samsung’s memory and foundry expertise with Broadcom’s AI and connectivity leadership, we aim to continue to deliver technologies that power the next generation of AI infrastructure.”
With capabilities encompassing memory, logic, foundry and advanced packaging, Samsung is uniquely positioned to deliver integrated semiconductor solutions for the AI era. The expanded collaboration with Broadcom reflects Samsung’s continued focus on supporting customers with end-to-end semiconductor technologies across an increasingly diverse range of AI and high-performance computing applications.
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